Prati
Takafumi Fukushima
Takafumi Fukushima
Associate Procfessor, Tohoku University
Potvrđena adresa e-pošte na lbc.mech.tohoku.ac.jp
Naslov
Citirano
Citirano
Godina
High-density through silicon vias for 3-D LSIs
M Koyanagi, T Fukushima, T Tanaka
Proceedings of the IEEE 97 (1), 49-59, 2009
3812009
Three-dimensional integration technology based on wafer bonding with vertical buried interconnections
M Koyanagi, T Nakamura, Y Yamada, H Kikuchi, T Fukushima, T Tanaka, ...
IEEE Transactions on Electron Devices 53 (11), 2799-2808, 2006
2842006
Three-dimensional integration technology and integrated systems
M Koyanagi, T Fukushima, T Tanaka
2009 Asia and South Pacific Design Automation Conference, 409-415, 2009
2822009
New three-dimensional integration technology using self-assembly technique
T Fukushima, Y Yamada, H Kikuchi, M Koyanagi
IEEE InternationalElectron Devices Meeting, 2005. IEDM Technical Digest …, 2005
1742005
Three-dimensional hybrid integration technology of CMOS, MEMS, and photonics circuits for optoelectronic heterogeneous integrated systems
KW Lee, A Noriki, K Kiyoyama, T Fukushima, T Tanaka, M Koyanagi
IEEE Transactions on Electron Devices 58 (3), 748-757, 2010
1312010
New three-dimensional integration technology based on reconfigured wafer-on-wafer bonding technique
T Fukushima, H Kikuchi, Y Yamada, T Konno, J Liang, K Sasaki, ...
2007 IEEE International Electron Devices Meeting, 985-988, 2007
1252007
Wafer thinning, bonding, and interconnects induced local strain/stress in 3D-LSIs with fine-pitch high-density microbumps and through-Si vias
M Murugesan, H Kino, H Nohira, JC Bea, A Horibe, F Yamada, ...
2010 International Electron Devices Meeting, 2.3. 1-2.3. 4, 2010
1202010
Heterogeneous integration at fine pitch (≤ 10 µm) using thermal compression bonding
AA Bajwa, SC Jangam, S Pal, N Marathe, T Bai, T Fukushima, M Goorsky, ...
2017 IEEE 67th electronic components and technology conference (ECTC), 1276-1284, 2017
1082017
Surface tension-driven chip self-assembly with load-free hydrogen fluoride-assisted direct bonding at room temperature for three-dimensional integrated circuits
T Fukushima, E Iwata, T Konno, JC Bea, KW Lee, T Tanaka, M Koyanagi
Applied Physics Letters 96 (15), 2010
1022010
Tungsten through-silicon via technology for three-dimensional LSIs
H Kikuchi, Y Yamada, AM Ali, J Liang, T Fukushima, T Tanaka, ...
Japanese Journal of Applied Physics 47 (4S), 2801, 2008
892008
New three-dimensional integration technology using chip-to-wafer bonding to achieve ultimate super-chip integration
T Fukushima, Y Yamada, H Kikuchi, M Koyanagi
Japanese Journal of Applied Physics 45 (4S), 3030, 2006
832006
Photosensitive fluorinated polyimides with a low dielectric constant based on reaction development patterning
T Miyagawa, T Fukushima, T Oyama, T Iijima, M Tomoi
Journal of Polymer Science Part A: Polymer Chemistry 41 (6), 861-871, 2003
712003
Three-dimensional integration technology based on reconfigured wafer-to-wafer and multichip-to-wafer stacking using self-assembly method
T Fukushima, E Iwata, Y Ohara, A Noriki, K Inamura, KW Lee, J Bea, ...
2009 IEEE International Electron Devices Meeting (IEDM), 1-4, 2009
702009
New concept of positive photosensitive polyimide: reaction development patterning (RDP)
T Fukushima, T Oyama, T Iijima, M Tomoi, H Itatani
Journal of Polymer Science Part A: Polymer Chemistry 39 (19), 3451-3463, 2001
682001
Multichip self-assembly technology for advanced die-to-wafer 3-D integration to precisely align known good dies in batch processing
T Fukushima, E Iwata, Y Ohara, M Murugesan, J Bea, K Lee, T Tanaka, ...
IEEE transactions on components, packaging and manufacturing technology 1 …, 2011
632011
New heterogeneous multi-chip module integration technology using self-assembly method
T Fukushima, T Konno, K Kiyoyama, M Murugesan, K Sato, WC Jeong, ...
2008 IEEE International Electron Devices Meeting, 1-4, 2008
622008
10 µm fine pitch Cu/Sn micro-bumps for 3-D super-chip stack
Y Ohara, A Noriki, K Sakuma, KW Lee, M Murugesan, J Bea, F Yamada, ...
2009 IEEE International Conference on 3D System Integration, 1-6, 2009
582009
Multichip-to-wafer three-dimensional integration technology using chip self-assembly with excimer lamp irradiation
T Fukushima, E Iwata, Y Ohara, M Murugesan, J Bea, K Lee, T Tanaka, ...
IEEE transactions on electron devices 59 (11), 2956-2963, 2012
572012
Reconfigured-wafer-to-wafer 3-D integration using parallel self-assembly of chips with Cu–SnAg microbumps and a nonconductive film
T Fukushima, J Bea, H Kino, C Nagai, M Murugesan, H Hashiguchi, ...
IEEE Transactions on Electron Devices 61 (2), 533-539, 2014
562014
Evaluation of Cu diffusion from Cu through-silicon via (TSV) in three-dimensional LSI by transient capacitance measurement
J Bea, K Lee, T Fukushima, T Tanaka, M Koyanagi
IEEE Electron Device Letters 32 (7), 940-942, 2011
562011
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