Rui Zhang
Rui Zhang
Research Associate, University of Manchester
Verified email at manchester.ac.uk
TitleCited byYear
Phase transformation and grain orientation of Cu–Sn intermetallic compounds during low temperature bonding process
C Hang, Y Tian, R Zhang, D Yang
Journal of Materials Science: Materials in Electronics 24 (10), 3905-3913, 2013
482013
Elastic properties of suspended multilayer WSe2
R Zhang, V Koutsos, R Cheung
Applied Physics Letters 108 (4), 042104, 2016
462016
Formation mechanism and orientation of Cu 3 Sn grains in Cu–Sn intermetallic compound joints
R Zhang, Y Tian, C Hang, B Liu, C Wang
Materials Letters 110, 137-140, 2013
462013
Relationship between morphologies and orientations of Cu 6 Sn 5 grains in Sn3. 0Ag0. 5Cu solder joints on different Cu pads
Y Tian, R Zhang, C Hang, L Niu, C Wang
Materials Characterization 88, 58-68, 2014
352014
Electromigration-induced intermetallic growth and voids formation in symmetrical Cu/Sn/Cu and Cu/Intermetallic compounds (IMCs)/Cu joints
R An, Y Tian, R Zhang, C Wang
Journal of Materials Science: Materials in Electronics 26 (5), 2674-2681, 2015
232015
Controlled Layer Thinning and p‐Type Doping of WSe2 by Vapor XeF2
R Zhang, D Drysdale, V Koutsos, R Cheung
Advanced Functional Materials 27 (41), 1702455, 2017
222017
Tunable MEMS cantilever resonators electrothermally actuated and piezoelectrically sensed
B Sviličić, E Mastropaolo, R Zhang, R Cheung
Microelectronic Engineering 145, 38-42, 2015
102015
Degradation behaviors of micro ball grid array (μBGA) solder joints under the coupled effects of electromigration and thermal stress
B Liu, Y Tian, J Qin, R An, R Zhang, C Wang
Journal of Materials Science: Materials in Electronics 27 (11), 11583-11592, 2016
82016
Optical lithography technique for the fabrication of devices from mechanically exfoliated two-dimensional materials
R Zhang, T Chen, A Bunting, R Cheung
Microelectronic Engineering 154, 62-68, 2016
72016
Mechanical Properties and Applications of Two-Dimensional Materials
R Zhang, R Cheung
Two-dimensional Materials-Synthesis, Characterization and Potential Applications, 2016
72016
Growth mechanism of Cu-Sn full IMC joints on polycrystalline and single crystal Cu substrate
R Zhang, Y Tian, B Liu, C Hang
Electronic Packaging Technology (ICEPT), 2013 14th International Conference …, 2013
22013
Experimental and theoretical studies of electronic and mechanical properties of two-dimensional (2D) WSe₂
R Zhang
The University of Edinburgh, 2018
2018
Rapid formation of Cu-Sn intermetallic compounds by strong electric current
B Liu, Y Tian, S Wang, R Zhang, X Zhao, C Dong, C Wang
Electronic Packaging Technology (ICEPT), 2014 15th International Conference …, 2014
2014
Electromigration failure of SnAgCu lead-free BGA package assembled with SnPb solder paste
Y Tian, B Liu, R Zhang, J Qin
Electronic Packaging Technology (ICEPT), 2013 14th International Conference …, 2013
2013
Effect of high temperature thermal aging on microstructural evolution of Sn3Ag0. 5Cu/Cu solder joints
H Li, M Fu, M Zhu, R An, C Wang, R Zhang
Electronic Packaging Technology (ICEPT), 2013 14th International Conference …, 2013
2013
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Articles 1–15