Elastic properties of suspended multilayer WSe2 R Zhang, V Koutsos, R Cheung Applied Physics Letters 108 (4), 042104, 2016 | 173 | 2016 |
Controlled Layer Thinning and p‐Type Doping of WSe2 by Vapor XeF2 R Zhang, D Drysdale, V Koutsos, R Cheung Advanced Functional Materials 27 (41), 1702455, 2017 | 109 | 2017 |
Formation mechanism and orientation of Cu 3 Sn grains in Cu–Sn intermetallic compound joints R Zhang, Y Tian, C Hang, B Liu, C Wang Materials Letters 110, 137-140, 2013 | 85 | 2013 |
Phase transformation and grain orientation of Cu–Sn intermetallic compounds during low temperature bonding process C Hang, Y Tian, R Zhang, D Yang Journal of Materials Science: Materials in Electronics 24 (10), 3905-3913, 2013 | 75 | 2013 |
Relationship between morphologies and orientations of Cu 6 Sn 5 grains in Sn3. 0Ag0. 5Cu solder joints on different Cu pads Y Tian, R Zhang, C Hang, L Niu, C Wang Materials Characterization 88, 58-68, 2014 | 72 | 2014 |
Toward Epitaxial Growth of Misorientation-Free Graphene on Cu (111) Foils L Sun, B Chen, W Wang, Y Li, X Zeng, H Liu, Y Liang, Z Zhao, A Cai, ... ACS nano, 2021 | 43 | 2021 |
Intrinsic Wettability in Pristine Graphene J Zhang, K Jia, Y Huang, X Liu, Q Xu, W Wang, R Zhang, B Liu, L Zheng, ... Advanced Materials, 2103620, 2021 | 42 | 2021 |
Mechanical properties and applications of two-dimensional materials R Zhang, R Cheung Two-dimensional Materials-Synthesis, Characterization and Potential …, 2016 | 39 | 2016 |
Electromigration-induced intermetallic growth and voids formation in symmetrical Cu/Sn/Cu and Cu/Intermetallic compounds (IMCs)/Cu joints R An, Y Tian, R Zhang, C Wang Journal of Materials Science: Materials in Electronics 26 (5), 2674-2681, 2015 | 39 | 2015 |
Large-area transfer of two-dimensional materials free of cracks, contamination and wrinkles via controllable conformal contact Y Zhao, Y Song, Z Hu, W Wang, Z Chang, Y Zhang, Q Lu, H Wu, J Liao, ... Nature Communications 13 (1), 1-10, 2022 | 34 | 2022 |
Exponentially selective molecular sieving through angstrom pores PZ Sun, M Yagmurcukardes, R Zhang, WJ Kuang, M Lozada-Hidalgo, ... Nature Communications 12 (1), 1-7, 2021 | 29 | 2021 |
Degradation behaviors of micro ball grid array (μBGA) solder joints under the coupled effects of electromigration and thermal stress B Liu, Y Tian, J Qin, R An, R Zhang, C Wang Journal of Materials Science: Materials in Electronics 27 (11), 11583-11592, 2016 | 25 | 2016 |
Optical lithography technique for the fabrication of devices from mechanically exfoliated two-dimensional materials R Zhang, T Chen, A Bunting, R Cheung Microelectronic Engineering 154, 62-68, 2016 | 18 | 2016 |
Tunable MEMS cantilever resonators electrothermally actuated and piezoelectrically sensed B Sviličić, E Mastropaolo, R Zhang, R Cheung Microelectronic Engineering 145, 38-42, 2015 | 15 | 2015 |
Fast synthesis of large-area bilayer graphene film on Cu J Zhang, X Liu, M Zhang, R Zhang, HQ Ta, J Sun, W Wang, W Zhu, T Fang, ... Nature Communications 14 (1), 3199, 2023 | 5 | 2023 |
The role of Cu crystallographic orientations towards growing superclean graphene on meter-sized scale X Liu, J Zhang, W Wang, W Zhao, H Chen, B Liu, M Zhang, F Liang, ... Nano Research, 1-6, 2021 | 4 | 2021 |
Growth mechanism of Cu-Sn full IMC joints on polycrystalline and single crystal Cu substrate R Zhang, Y Tian, B Liu, C Hang Electronic Packaging Technology (ICEPT), 2013 14th International Conference …, 2013 | 3 | 2013 |
Rapid formation of Cu-Sn intermetallic compounds by strong electric current B Liu, Y Tian, S Wang, R Zhang, X Zhao, C Dong, C Wang Electronic Packaging Technology (ICEPT), 2014 15th International Conference …, 2014 | 1 | 2014 |
Electromigration failure of SnAgCu lead-free BGA package assembled with SnPb solder paste Y Tian, B Liu, R Zhang, J Qin Electronic Packaging Technology (ICEPT), 2013 14th International Conference …, 2013 | 1 | 2013 |
Copper acetate-facilitated transfer-free growth of high-quality graphene advancing hydrovoltaic electricity generators J Shan, S Fang, W Wang, W Zhao, R Zhang, B Liu, L Lin, B Jiang, H Ci, ... National Science Review, 2021 | | 2021 |