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Rui Zhang
Rui Zhang
Research Associate, University of Manchester
Verified email at manchester.ac.uk
Title
Cited by
Cited by
Year
Elastic properties of suspended multilayer WSe2
R Zhang, V Koutsos, R Cheung
Applied Physics Letters 108 (4), 042104, 2016
1732016
Controlled Layer Thinning and p‐Type Doping of WSe2 by Vapor XeF2
R Zhang, D Drysdale, V Koutsos, R Cheung
Advanced Functional Materials 27 (41), 1702455, 2017
1092017
Formation mechanism and orientation of Cu 3 Sn grains in Cu–Sn intermetallic compound joints
R Zhang, Y Tian, C Hang, B Liu, C Wang
Materials Letters 110, 137-140, 2013
852013
Phase transformation and grain orientation of Cu–Sn intermetallic compounds during low temperature bonding process
C Hang, Y Tian, R Zhang, D Yang
Journal of Materials Science: Materials in Electronics 24 (10), 3905-3913, 2013
752013
Relationship between morphologies and orientations of Cu 6 Sn 5 grains in Sn3. 0Ag0. 5Cu solder joints on different Cu pads
Y Tian, R Zhang, C Hang, L Niu, C Wang
Materials Characterization 88, 58-68, 2014
722014
Toward Epitaxial Growth of Misorientation-Free Graphene on Cu (111) Foils
L Sun, B Chen, W Wang, Y Li, X Zeng, H Liu, Y Liang, Z Zhao, A Cai, ...
ACS nano, 2021
432021
Intrinsic Wettability in Pristine Graphene
J Zhang, K Jia, Y Huang, X Liu, Q Xu, W Wang, R Zhang, B Liu, L Zheng, ...
Advanced Materials, 2103620, 2021
422021
Mechanical properties and applications of two-dimensional materials
R Zhang, R Cheung
Two-dimensional Materials-Synthesis, Characterization and Potential …, 2016
392016
Electromigration-induced intermetallic growth and voids formation in symmetrical Cu/Sn/Cu and Cu/Intermetallic compounds (IMCs)/Cu joints
R An, Y Tian, R Zhang, C Wang
Journal of Materials Science: Materials in Electronics 26 (5), 2674-2681, 2015
392015
Large-area transfer of two-dimensional materials free of cracks, contamination and wrinkles via controllable conformal contact
Y Zhao, Y Song, Z Hu, W Wang, Z Chang, Y Zhang, Q Lu, H Wu, J Liao, ...
Nature Communications 13 (1), 1-10, 2022
342022
Exponentially selective molecular sieving through angstrom pores
PZ Sun, M Yagmurcukardes, R Zhang, WJ Kuang, M Lozada-Hidalgo, ...
Nature Communications 12 (1), 1-7, 2021
292021
Degradation behaviors of micro ball grid array (μBGA) solder joints under the coupled effects of electromigration and thermal stress
B Liu, Y Tian, J Qin, R An, R Zhang, C Wang
Journal of Materials Science: Materials in Electronics 27 (11), 11583-11592, 2016
252016
Optical lithography technique for the fabrication of devices from mechanically exfoliated two-dimensional materials
R Zhang, T Chen, A Bunting, R Cheung
Microelectronic Engineering 154, 62-68, 2016
182016
Tunable MEMS cantilever resonators electrothermally actuated and piezoelectrically sensed
B Sviličić, E Mastropaolo, R Zhang, R Cheung
Microelectronic Engineering 145, 38-42, 2015
152015
Fast synthesis of large-area bilayer graphene film on Cu
J Zhang, X Liu, M Zhang, R Zhang, HQ Ta, J Sun, W Wang, W Zhu, T Fang, ...
Nature Communications 14 (1), 3199, 2023
52023
The role of Cu crystallographic orientations towards growing superclean graphene on meter-sized scale
X Liu, J Zhang, W Wang, W Zhao, H Chen, B Liu, M Zhang, F Liang, ...
Nano Research, 1-6, 2021
42021
Growth mechanism of Cu-Sn full IMC joints on polycrystalline and single crystal Cu substrate
R Zhang, Y Tian, B Liu, C Hang
Electronic Packaging Technology (ICEPT), 2013 14th International Conference …, 2013
32013
Rapid formation of Cu-Sn intermetallic compounds by strong electric current
B Liu, Y Tian, S Wang, R Zhang, X Zhao, C Dong, C Wang
Electronic Packaging Technology (ICEPT), 2014 15th International Conference …, 2014
12014
Electromigration failure of SnAgCu lead-free BGA package assembled with SnPb solder paste
Y Tian, B Liu, R Zhang, J Qin
Electronic Packaging Technology (ICEPT), 2013 14th International Conference …, 2013
12013
Copper acetate-facilitated transfer-free growth of high-quality graphene advancing hydrovoltaic electricity generators
J Shan, S Fang, W Wang, W Zhao, R Zhang, B Liu, L Lin, B Jiang, H Ci, ...
National Science Review, 2021
2021
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