| Stability and delay analysis of multi-layered GNR and multi-walled CNT interconnects VR Kumar, MK Majumder, A Alam, NR Kukkam, BK Kaushik Journal of Computational Electronics 14, 611-618, 2015 | 59 | 2015 |
| Flexible hybrid electronics technology using die-first FOWLP for high-performance and scalable heterogeneous system integration T Fukushima, A Alam, A Hanna, SC Jangam, AA Bajwa, SS Iyer IEEE Transactions on Components, Packaging and Manufacturing Technology 8 …, 2018 | 51 | 2018 |
| An unconditionally stable FDTD model for crosstalk analysis of VLSI interconnects VR Kumar, A Alam, BK Kaushik, A Patnaik IEEE Transactions on Components, Packaging and Manufacturing Technology 5 …, 2015 | 47 | 2015 |
| Through silicon vias: materials, models, design, and performance BK Kaushik, VR Kumar, MK Majumder, A Alam Crc Press, 2016 | 36 | 2016 |
| “FlexTrate^ TM”—Scaled Heterogeneous Integration on Flexible Biocompatible Substrates Using FOWLP T Fukushima, A Alam, Z Wan, SC Jangam, S Pal, G Ezhilarasu, A Bajwa, ... 2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 649-654, 2017 | 31 | 2017 |
| Expandable Polymer Enabled Wirelessly Destructible High‐Performance Solid State Electronics A Gumus, A Alam, AM Hussain, K Mishra, I Wicaksono, GA Torres Sevilla, ... Advanced Materials Technologies 2 (5), 1600264, 2017 | 28 | 2017 |
| Extremely Flexible (1mm Bending Radius) Biocompatible Heterogeneous Fan-Out Wafer-Level Platform with the Lowest Reported Die-Shift (< 6 µm) and Reliable Flexible Cu-Based … A Hanna, A Alam, T Fukushima, S Moran, W Whitehead, SC Jangam, ... 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 1505-1511, 2018 | 27 | 2018 |
| A flexible, heterogeneously integrated wireless powered system for bio-implantable applications using fan-out wafer-level packaging G Ezhilarasu, A Hanna, R Irwin, A Alam, SS Iyer 2018 IEEE International Electron Devices Meeting (IEDM), 29.7. 1-29.7. 4, 2018 | 23 | 2018 |
| Performance analysis of single-and multi-walled carbon nanotube based through silicon vias A Alam, MK Majumder, A Kumari, VR Kumar, BK Kaushik 2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 1834-1839, 2015 | 20 | 2015 |
| Heterogeneous integration of a fan-out wafer-level packaging based foldable display on elastomeric substrate A Alam, A Hanna, R Irwin, G Ezhilarasu, H Boo, Y Hu, CW Wong, ... 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 277-282, 2019 | 17 | 2019 |
| A high spatial resolution surface electromyography (sEMG) system using fan-out wafer-level packaging on FlexTrate™ A Alam, M Molter, B Gaonkar, A Hanna, R Irwin, S Benedict, G Ezhilarasu, ... 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 985-990, 2020 | 14 | 2020 |
| Self-assembly technologies for FlexTrate™ T Fukushima, Y Susumago, H Kino, T Tanaka, A Alam, A Hanna, S Iyer 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 1836-1841, 2018 | 10 | 2018 |
| Flexible heterogeneously integrated low form factor wireless multi-channel surface electromyography (sEMG) device A Alam, M Molter, A Kapoor, B Gaonkar, S Benedict, L Macyszyn, ... 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 1544-1549, 2021 | 7 | 2021 |
| Signal integrity improvement with peripherally placed MWCNTs in mixed CNT bundle based TSVs MK Majumder, A Kumari, A Alam, VR Kumar, BK Kaushik 2015 IEEE International Conference on Electron Devices and Solid-State …, 2015 | 7 | 2015 |
| Process Integration for FlexTrateTM T Fukushima, Y Susumago, H Kino, T Tanaka, A Alam, A Hanna, SS Iyer 2018 International Flexible Electronics Technology Conference (IFETC), 1-2, 2018 | 4 | 2018 |
| Comprehensive Investigation of In-Plane and Out-of-Plane Die Shift in Flexible Fan-Out Wafer-Level Packaging Using Polydimethylsiloxane G Ouyang, A Hanna, S Benedict, G Ezhilarasu, A Alam, RW Irwin, SS Iyer IEEE Transactions on Components, Packaging and Manufacturing Technology 12 …, 2022 | 3 | 2022 |
| Smartphone App-Enabled Flex sEMG Patch using FOWLP P Venkatesh, R Irwin, A Alam, M Molter, A Kapoor, B Gaonkar, ... 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 2263-2268, 2022 | 3 | 2022 |
| Flexible and stretchable interconnects for flexible systems SS Iyer, A Alam, A Hanna, T Fukushima US Patent 11,538,764, 2022 | 2 | 2022 |
| Flexible Hybrid Electronics Using Fan‐Out Wafer‐Level Packaging SS Iyer, A Alam Embedded and Fan‐Out Wafer and Panel Level Packaging Technologies for …, 2022 | 2 | 2022 |
| Heterogenous integration of MEMS gas sensor using FOWLP: Personal environment monitors S Benedict, A Nagarajan, K Thejas, A Alam, MS Illango, G Ezhilarasu, ... 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 824-828, 2020 | 2 | 2020 |
