| Design approach to sealant selection for the life of the well M Bosma, K Ravi, W Driel, GJ Schreppers SPE Annual Technical Conference and Exhibition?, SPE-56536-MS, 1999 | 260 | 1999 |
| Mechanics of microelectronics GQ Zhang, WD Van Driel, XJ Fan Springer Science & Business Media, 2006 | 249 | 2006 |
| Solid state lighting reliability part 2 WD Van Driel, XJ Fan, GQ Zhang Cham, Switzerland: Springer, 527-547, 2017 | 231 | 2017 |
| Time-dependent mechanical behaviour of the periodontal ligament WD Van Driel, EJ Van Leeuwen, JW Von den Hoff, JC Maltha, ... Proceedings of the Institution of Mechanical Engineers, Part H: Journal of …, 2000 | 135 | 2000 |
| Interfacial delamination mechanisms during soldering reflow with moisture preconditioning X Fan, GQ Zhang, WD Van Driel, LJ Ernst IEEE Transactions on Components and Packaging Technologies 31 (2), 252-259, 2008 | 110 | 2008 |
| Photodegradation of bisphenol A polycarbonate under blue light radiation and its effect on optical properties MY Mehr, WD Van Driel, KMB Jansen, P Deeben, M Boutelje, GQ Zhang Optical Materials 35 (3), 504-508, 2013 | 90 | 2013 |
| Stress–strain characteristics of tin-based solder alloys for drop-impact modeling EH Wong, CS Selvanayagam, SKW Seah, WD Van Driel, J Caers, ... Journal of Electronic Materials 37, 829-836, 2008 | 89 | 2008 |
| Semiconductor device JJ Dimasacat, JL Tan, WD Van Driel US Patent 7,838,973, 2010 | 79 | 2010 |
| Advances in the drop-impact reliability of solder joints for mobile applications EH Wong, SKW Seah, WD Van Driel, J Caers, N Owens, YS Lai Microelectronics Reliability 49 (2), 139-149, 2009 | 79 | 2009 |
| A comparison of finite element codes for the solution of biphasic poroelastic problems PJ Prendergast, WD Van Driel, JH Kuiper Proceedings of the Institution of Mechanical Engineers, Part H: Journal of …, 1996 | 75 | 1996 |
| Degradation of optical materials in solid-state lighting systems M Yazdan Mehr, A Bahrami, WD van Driel, XJ Fan, JL Davis, GQ Zhang International Materials Reviews 65 (2), 102-128, 2020 | 74 | 2020 |
| Creep fatigue models of solder joints: A critical review EH Wong, WD Van Driel, A Dasgupta, M Pecht Microelectronics Reliability 59, 1-12, 2016 | 73 | 2016 |
| Driving mechanisms of delamination related reliability problems in exposed pad packages WD van Driel, MAJ van Gils, X Fan, GQ Zhang, LJ Ernst IEEE Transactions on Components and Packaging Technologies 31 (2), 260-268, 2008 | 64 | 2008 |
| Prediction and verification of process induced warpage of electronic packages WD Van Driel, GQ Zhang, JHJ Janssen, LJ Ernst, F Su, KS Chian, S Yi Microelectronics Reliability 43 (5), 765-774, 2003 | 63 | 2003 |
| Lifetime assessment of Bisphenol-A Polycarbonate (BPA-PC) plastic lens, used in LED-based products MY Mehr, WD Van Driel, KMB Jansen, P Deeben, GQ Zhang Microelectronics Reliability 54 (1), 138-142, 2014 | 59 | 2014 |
| Packaging induced die stresses—Effect of chip anisotropy and time-dependent behavior of a molding compound WD Van Driel, JHJ Janssen, GQ Zhang, DG Yang, LJ Ernst J. Electron. Packag. 125 (4), 520-526, 2003 | 57 | 2003 |
| Response surface modeling for nonlinear packaging stresses WD Van Driel, GQ Zhang, JHJ Janssen, LJ Ernst J. Electron. Packag. 125 (4), 490-497, 2003 | 57 | 2003 |
| Why does intermittent hydrostatic pressure enhance the mineralization process in fetal cartilage? E Tanck, WD Van Driel, JW Hagen, EH Burger, L Blankevoort, R Huiskes Journal of Biomechanics 32 (2), 153-161, 1999 | 56 | 1999 |
| Fracture morphology and mechanism of IMC in Low-Ag SAC Solder/UBM (Ni (P)-Au) for WLCSP F Sun, P Hochstenbach, WD Van Driel, GQ Zhang Microelectronics Reliability 48 (8-9), 1167-1170, 2008 | 55 | 2008 |
| Numerical modeling of warpage induced in QFN array molding process DG Yang, KMB Jansen, LJ Ernst, GQ Zhang, WD Van Driel, HJL Bressers, ... Microelectronics Reliability 47 (2-3), 310-318, 2007 | 54 | 2007 |
