| Heterogeneous integration at fine pitch (≤ 10 µm) using thermal compression bonding AA Bajwa, SC Jangam, S Pal, N Marathe, T Bai, T Fukushima, M Goorsky, ... 2017 IEEE 67th electronic components and technology conference (ECTC), 1276-1284, 2017 | 109 | 2017 |
| Latency, bandwidth and power benefits of the superchips integration scheme SC Jangam, S Pal, A Bajwa, S Pamarti, P Gupta, SS Iyer 2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 86-94, 2017 | 58 | 2017 |
| Flexible hybrid electronics technology using die-first FOWLP for high-performance and scalable heterogeneous system integration T Fukushima, A Alam, A Hanna, SC Jangam, AA Bajwa, SS Iyer IEEE Transactions on Components, Packaging and Manufacturing Technology 8 …, 2018 | 51 | 2018 |
| Electrical characterization of high performance fine pitch interconnects in silicon-interconnect fabric SC Jangam, AA Bajwa, KK Thankkappan, P Kittur, SS Iyer 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 1283-1288, 2018 | 48 | 2018 |
| Silicon-interconnect fabric for fine-pitch (≤ 10 μm) heterogeneous integration SC Jangam, SS Iyer IEEE Transactions on Components, Packaging and Manufacturing Technology 11 …, 2021 | 42 | 2021 |
| Silicon interconnect fabric: A versatile heterogeneous integration platform for AI systems SS Iyer, S Jangam, B Vaisband IBM Journal of Research and Development 63 (6), 5: 1-5: 16, 2019 | 41 | 2019 |
| Fine-pitch (≤ 10 µm) direct Cu-Cu interconnects using in-situ formic acid vapor treatment SC Jangam, AA Bajwa, U Mogera, P Ambhore, T Colosimo, B Chylak, ... 2019 IEEE 69th electronic components and technology conference (ECTC), 620-627, 2019 | 41 | 2019 |
| “FlexTrate^ TM”—Scaled Heterogeneous Integration on Flexible Biocompatible Substrates Using FOWLP T Fukushima, A Alam, Z Wan, SC Jangam, S Pal, G Ezhilarasu, A Bajwa, ... 2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 649-654, 2017 | 32 | 2017 |
| Extremely Flexible (1mm Bending Radius) Biocompatible Heterogeneous Fan-Out Wafer-Level Platform with the Lowest Reported Die-Shift (< 6 µm) and Reliable Flexible Cu-Based … A Hanna, A Alam, T Fukushima, S Moran, W Whitehead, SC Jangam, ... 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 1505-1511, 2018 | 26 | 2018 |
| Demonstration of a heterogeneously integrated system-on-wafer (SoW) assembly AA Bajwa, SC Jangam, S Pal, B Vaisband, R Irwin, M Goorsky, SS Iyer 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 1926-1930, 2018 | 24 | 2018 |
| Demonstration of a Low Latency (< 20 ps) Fine-pitch (≤ 10 μm) Assembly on the Silicon Interconnect Fabric SC Jangam, U Rathore, S Nagi, D Markovic, SS Iyer 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 1801-1805, 2020 | 17 | 2020 |
| Heterogeneous Integration on Silicon-Interconnect Fabric Using Fine-Pitch Interconnects (≤10 µm) SC Jangam University of California, Los Angeles, 2020 | 14 | 2020 |
| A signaling figure of merit (s-FoM) for advanced packaging SC Jangam, SS Iyer IEEE Transactions on Components, Packaging and Manufacturing Technology 10 …, 2020 | 11 | 2020 |
| Design of a multi-layered QCA configurable logic block for FPGAs B Ghosh, JS Chandra, A Salimath Journal of Circuits, Systems and Computers 23 (06), 1450089, 2014 | 11 | 2014 |
| Clocking scheme implementation for Multi-Layered quantum dot cellular automata design JS Chandra, K Suresh, B Ghosh Journal of Low Power Electronics 10 (2), 272-278, 2014 | 8 | 2014 |
| Functional demonstration of< 0.4-pJ/bit, 9.8 μm fine-pitch dielet-to-dielet links for advanced packaging using silicon interconnect fabric K Sahoo, U Rathore, SC Jangam, T Nguyen, D Markovic, SS Iyer 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 2104-2110, 2022 | 5 | 2022 |
| Reliability Studies of Silicon Interconnect Fabric N Shakoorzadeh, SC Jangam, K Rahim, P Ambhore, H Chien, A Hanna, ... 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 800-805, 2019 | 5 | 2019 |
| Integration and Characterization of InP Die on Silicon Interconnect Fabric E Sorensen, B Vaisband, SC Jangam, T Shirley, SS Iyer 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 543-549, 2019 | 4 | 2019 |
| TakafumiFukushima, Mark Goorsky, Subramanian S. Iyer,“Heterogeneous Integration at Fine Pitch 10 μm) using Thermal Compression Bonding” AA Bajwa, SC Jangam, S Pal, N Marathe, T Bai Electronic Components and Technology Conference, 1276-1284, 2017 | 3 | 2017 |
| Process development and material characterization of Cu-Cu thermo-compression bonding (TCB) for high-conductivity electrical interconnects. A Bajwa, N Marathe, SC Jangam, S Pal, PY Liu, M Goorsky, SS Iyer International Symposium on Microelectronics 2016 (1), 000203-000208, 2016 | 3 | 2016 |
SUBRAMANIAN S. IYERUniversity of California at Los Angeles,Potvrđena adresa e-pošte na g.ucla.edu
