EMI reduction methods in wireless power transfer system for drone electrical charger using tightly coupled three-phase resonant magnetic field C Song, H Kim, Y Kim, D Kim, S Jeong, Y Cho, S Lee, S Ahn, J Kim IEEE Transactions on Industrial Electronics 65 (9), 6839-6849, 2018 | 121 | 2018 |
Deep reinforcement learning-based optimal decoupling capacitor design method for silicon interposer-based 2.5-D/3-D ICs H Park, J Park, S Kim, K Cho, D Lho, S Jeong, S Park, G Park, B Sim, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 10 …, 2020 | 58 | 2020 |
Through silicon via (TSV) defect modeling, measurement, and analysis DH Jung, Y Kim, JJ Kim, H Kim, S Choi, YH Song, HC Bae, KS Choi, ... IEEE transactions on components, packaging and manufacturing technology 7 (1 …, 2016 | 58 | 2016 |
Signal integrity design and analysis of silicon interposer for GPU-memory channels in high-bandwidth memory interface K Cho, Y Kim, H Lee, H Kim, S Choi, J Song, S Kim, J Park, S Lee, J Kim IEEE Transactions on Components, Packaging and Manufacturing Technology 8 (9 …, 2018 | 50 | 2018 |
Signal and power integrity analysis in 2.5 D integrated circuits (ICs) with glass, silicon and organic interposer Y Kim, J Cho, K Kim, V Sundaram, R Tummala, J Kim 2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 738-743, 2015 | 32 | 2015 |
Signal integrity design and analysis of differential high-speed serial links in silicon interposer with through-silicon via K Cho, Y Kim, H Lee, J Song, J Park, S Lee, S Kim, G Park, K Son, J Kim IEEE Transactions on Components, Packaging and Manufacturing Technology 9 (1 …, 2018 | 30 | 2018 |
Design optimization of high bandwidth memory (HBM) interposer considering signal integrity K Cho, H Lee, H Kim, S Choi, Y Kim, J Lim, J Kim, H Kim, Y Kim, Y Kim 2015 IEEE Electrical Design of Advanced Packaging and Systems Symposium …, 2015 | 27 | 2015 |
Miniaturized bandpass filters as ultrathin 3-D IPDs and embedded thinfilms in 3-D glass modules S Sitaraman, V Sukumaran, MR Pulugurtha, Z Wu, Y Suzuki, Y Kim, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 7 (9 …, 2017 | 25 | 2017 |
Design and analysis of power distribution network (PDN) for high bandwidth memory (HBM) interposer in 2.5 D terabyte/s bandwidth graphics module K Cho, Y Kim, H Lee, H Kim, S Choi, S Kim, J Kim 2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 407-412, 2016 | 25 | 2016 |
Fast and accurate power distribution network modeling of a silicon interposer for 2.5-D/3-D ICs with multiarray TSVs K Cho, Y Kim, S Kim, H Park, J Park, S Lee, D Shim, K Lee, S Oh, J Kim IEEE Transactions on Components, Packaging and Manufacturing Technology 9 (9 …, 2019 | 23 | 2019 |
Power distribution network design and optimization based on frequency dependent target impedance Y Kim, K Kim, J Cho, J Kim, K Kang, T Yang, Y Ra, W Paik 2015 IEEE Electrical Design of Advanced Packaging and Systems Symposium …, 2015 | 23 | 2015 |
A frequency-selective EMI reduction method for tightly coupled wireless power transfer systems using resonant frequency control of a shielding coil in smartphone application S Hong, Y Kim, S Lee, S Jeong, B Sim, H Kim, J Song, S Ahn, J Kim IEEE Transactions on Electromagnetic Compatibility 61 (6), 2031-2039, 2019 | 22 | 2019 |
Highly-effective integrated EMI shields with graphene and nanomagnetic multilayered composites AO Watanabe, S Jeong, S Kim, Y Kim, J Min, D Wong, MR Pulugurtha, ... 2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 206-210, 2016 | 22 | 2016 |
A Near Field Analytical Model for EMI Reduction and Efficiency Enhancement Using an nth Harmonic Frequency Shielding Coil in a Loosely Coupled Automotive WPT System B Sim, S Jeong, Y Kim, S Park, S Lee, S Hong, J Song, H Kim, H Kang, ... IEEE Transactions on Electromagnetic Compatibility 63 (3), 935-946, 2020 | 20 | 2020 |
Measurement and analysis of glass interposer power distribution network resonance effects on a high-speed through glass via channel Y Kim, J Cho, JJ Kim, K Kim, K Cho, S Kim, S Sitaraman, V Sundaram, ... IEEE Transactions on Electromagnetic Compatibility 58 (6), 1747-1759, 2016 | 20 | 2016 |
Precise RLGC modeling and analysis of through glass via (TGV) for 2.5 D/3D IC J Kim, I Hwang, Y Kim, J Cho, V Sundaram, R Tummala, J Kim 2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 254-259, 2015 | 19 | 2015 |
Design and measurement of a novel on-interposer active power distribution network for efficient simultaneous switching noise suppression in 2.5-D/3-D IC S Kim, Y Kim, K Cho, J Song, J Kim IEEE Transactions on Components, Packaging and Manufacturing Technology 9 (2 …, 2018 | 18 | 2018 |
Power distribution network (PDN) design and analysis of a single and double-sided high bandwidth memory (HBM) interposer for 2.5 D terabtye/s bandwidth system K Cho, Y Kim, S Kim, H Lee, S Choi, H Kim, J Kim 2016 IEEE International Symposium on Electromagnetic Compatibility (EMC), 96-99, 2016 | 16 | 2016 |
Design of an on-interposer passive equalizer for high bandwidth memory (HBM) with 30Gbps data transmission Y Jeon, H Kim, S Choi, Y Kim, J Kim 2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 2475-2480, 2016 | 16 | 2016 |
Analysis of power distribution network in glass, silicon interposer and PCB Y Kim, K Kim, J Cho, J Kim, V Sundaram, R Tummala 2014 IEEE International Symposium on Electromagnetic Compatibility (EMC …, 2014 | 16 | 2014 |