Prati
Erwin Bosman
Erwin Bosman
Centre for Microsystems Technology (CMST), imec and Ghent University
Potvrđena adresa e-pošte na Elis.ugent.be
Naslov
Citirano
Citirano
Godina
Stretchable optical waveguides
J Missinne, S Kalathimekkad, B Van Hoe, E Bosman, J Vanfleteren, ...
Optics Express 22 (4), 4168-4179, 2014
1132014
UTCP: A novel polyimide-based ultra-thin chip packaging technology
W Christiaens, E Bosman, J Vanfleteren
IEEE transactions on components and packaging technologies 33 (4), 754-760, 2010
922010
Laser ablation of parallel optical interconnect waveguides
G Van Steenberge, N Hendrickx, E Bosman, J Van Erps, H Thienpont, ...
IEEE Photonics Technology Letters 18 (9), 1106-1108, 2006
822006
Highly reliable flexible active optical links
E Bosman, G Van Steenberge, B Van Hoe, J Missinne, J Vanfleteren, ...
IEEE Photonics Technology Letters 22 (5), 287-289, 2010
602010
Flexible shear sensor based on embedded optoelectronic components
J Missinne, E Bosman, B Van Hoe, G Van Steenberge, S Kalathimekkad, ...
IEEE Photonics Technology Letters 23 (12), 771-773, 2011
572011
Comparison of epoxy-and siloxane-based single-mode optical waveguides defined by direct-write lithography
A Elmogi, E Bosman, J Missinne, G Van Steenberge
Optical Materials 52, 26-31, 2016
522016
Ultrathin optoelectronic device packaging in flexible carriers
E Bosman, J Missinne, B Van Hoe, G Van Steenberge, S Kalathimekkad, ...
IEEE Journal of selected topics in quantum electronics 17 (3), 617-628, 2011
512011
Fabrication processes for embedding thin chips in flat flexible substrates
J Govaerts, W Christiaens, E Bosman, J Vanfleteren
IEEE transactions on Advanced Packaging 32 (1), 77-83, 2009
512009
Optical tactile sensors
G Van Steenberge, E Bosman, H Thienpont
US Patent 8,567,257, 2013
452013
Ultra small integrated optical fiber sensing system
B Van Hoe, G Lee, E Bosman, J Missinne, S Kalathimekkad, O Maskery, ...
Sensors 12 (9), 12052-12069, 2012
432012
Embedded micromirror inserts for optical printed circuit boards
N Hendrickx, J Van Erps, E Bosman, C Debaes, H Thienpont, ...
IEEE Photonics Technology Letters 20 (20), 1727-1729, 2008
392008
Embedded flexible optical shear sensor
J Missinne, E Bosman, B Van Hoe, G Van Steenberge, P Van Daele, ...
SENSORS, 2010 IEEE, 987-990, 2010
382010
Two axis optoelectronic tactile shear stress sensor
J Missinne, E Bosman, B Van Hoe, R Verplancke, G Van Steenberge, ...
Sensors and Actuators A: Physical 186, 63-68, 2012
242012
Ultra-thin chip technology and applications
A Dietzel, J van den Brand, J Vanfleteren, W Christiaens, E Bosman, ...
edited by JN Burghartz (Springer Verlag, New York, 2011), 141-157, 2011
202011
Fine-pitch capabilities of the flat ultra-thin chip packaging (UTCP) technology
J Govaerts, E Bosman, W Christiaens, J Vanfleteren
IEEE transactions on Advanced Packaging 33 (1), 72-78, 2009
192009
UTCP: 60 µm thick bendable package
W Christiaens, B Vandevelde, E Bosman, J Vanfleteren
3rd International Wafer-Level Packaging Conference (IWLPC 2006), 114-119, 2006
162006
Ultra thin optical tactile shear sensor
J Missinne, E Bosman, B Van Hoe, R Verplancke, G Van Steenberge, ...
Procedia Engineering 25, 1393-1396, 2011
142011
System-in-foil technology
A Dietzel, J van den Brand, J Vanfleteren, W Christiaens, E Bosman, ...
Ultra-thin chip technology and applications, 141-157, 2010
122010
Fully flexible optoelectronic foil
E Bosman, G Van Steenberge, I Milenkov, K Panajotov, H Thienpont, ...
IEEE Journal of selected topics in quantum electronics 16 (5), 1355-1362, 2010
112010
Optical shear sensor and method of producing such an optical shear sensor
G Van Steenberge, J Missinne, E Bosman, B Van Hoe
US Patent 8,780,335, 2014
102014
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