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### Co-authors

- Mark J.W. RodwellProfessor of Electrical and Computer Engineering, University of California, Santa BarbaraVerified email at ece.ucsb.edu
- Cheng-Ying HuangIntelVerified email at intel.com
- Brian ThibeaultTechnical and Operational Director, UCSB Nanofabrication FacilityVerified email at ucsb.edu
- James Jeremy MacDonald LawGener8Verified email at gener8.net
- Roman Engel-HerbertAssoc. Professor of Materials Science and Engineering, Chemistry and Physics, The Pennsylvania StateVerified email at psu.edu
- Andrew CarterTeledyne Scientific and ImagingVerified email at teledyne.com
- Jack ZhangUCSBVerified email at umail.ucsb.edu
- Yoon Tae HwangVerified email at samsung.com
- Abdullah,Mohd Mustafa Al BakriProfessor in Construction Materials at Universiti Malaysia Perlis (UniMAP)Verified email at unimap.edu.my
- Dewi Suriyani Che HalinUniversiti Malaysia PerlisVerified email at unimap.edu.my
- Junwoo SonPohang University of Science and Technology (POSTECH)Verified email at postech.ac.kr
- Kamrosni Abdul RazakLecturer, University Malaysia PerlisVerified email at unimap.edu.my
- Rahul PandeyIntel CorporationVerified email at intel.com
- Brian M. McSkimmingThe University of OklahomaVerified email at ou.edu

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Varistha Chobpattana

Faculty of Engineering, Rajamangala University of Technology Thanyaburi (RMUTT)

Verified email at en.rmutt.ac.th - Homepage