| Design, fabrication, and characterization of dense compressible microinterconnects PK Jo, M Zia, JL Gonzalez, H Oh, MS Bakir IEEE Transactions on Components, Packaging and Manufacturing Technology 7 (7 …, 2017 | 14 | 2017 |
| Heterogeneous multi-die stitching enabled by fine-pitch and multi-height compressible microinterconnects (CMIs) PK Jo, X Zhang, JL Gonzalez, GS May, MS Bakir IEEE Transactions on Electron Devices 65 (7), 2957-2963, 2018 | 12 | 2018 |
| Fiber-interconnect silicon chiplet technology for self-aligned fiber-to-chip assembly C Wan, JL Gonzalez, T Fan, A Adibi, TK Gaylord, MS Bakir IEEE Photonics Technology Letters 31 (16), 1311-1314, 2019 | 9 | 2019 |
| Flexible interconnect design using a mechanically-focused, multi-objective genetic algorithm JL Gonzalez, PK Jo, R Abbaspour, MS Bakir Journal of Microelectromechanical Systems 27 (4), 677-685, 2018 | 7 | 2018 |
| 3-D integrated electronic microplate platform for low-cost repeatable biosensing applications M Zia, T Chi, JS Park, A Su, JL Gonzalez, PK Jo, MP Styczynski, H Wang, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 6 …, 2016 | 7 | 2016 |
| Microfabrication, coil characterization, and hermetic packaging of millimeter-sized free-floating neural probes P Yeon, SK Rajan, J Falcone, JL Gonzalez, GS May, RV Bellamkonda, ... IEEE Sensors Journal 21 (12), 13837-13848, 2021 | 6 | 2021 |
| Thermomechanical analysis and package-level optimization of mechanically flexible interconnects for interposer-on-motherboard assembly MO Hossen, JL Gonzalez, MS Bakir IEEE Transactions on Components, Packaging and Manufacturing Technology 8 …, 2018 | 6 | 2018 |
| Microfabrication, assembly, and hermetic packaging of mm-sized free-floating neural probes P Yeon, JL Gonzalez, M Zia, SK Rajan, GS May, MS Bakir, M Ghovanloo 2017 IEEE Biomedical Circuits and Systems Conference (BioCAS), 1-4, 2017 | 6 | 2017 |
| Dense and highly elastic compressible microinterconnects (CMIs) for electronic microsystems PK Jo, M Zia, JL Gonzalez, MS Bakir 2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 684-689, 2017 | 5 | 2017 |
| A microfabricated electronic microplate platform for low-cost repeatable biosensing applications M Zia, T Chi, C Zhang, P Thadesar, T Hookway, J Gonzalez, T McDevitt, ... 2015 IEEE International Electron Devices Meeting (IEDM), 29.4. 1-29.4. 4, 2015 | 5 | 2015 |
| Power conversion gain as a design metric for RFID systems MJ Almada, L Blanca-Pimentel, JT Block, JL Gonzalez, CR Valenta, ... Proceedings of the 2012 IEEE International Symposium on Antennas and …, 2012 | 5 | 2012 |
| Polylithic integration of 2.5-D and 3-D chiplets enabled by multi-height and fine-pitch CMIs PK Jo, SK Rajan, JL Gonzalez, MS Bakir IEEE Transactions on Components, Packaging and Manufacturing Technology 10 …, 2020 | 4 | 2020 |
| A disposable and self-aligned 3-D integrated bio-sensing interface module for CMOS cell-based biosensor applications JL Gonzalez, PK Jo, R Abbaspour, MS Bakir IEEE Electron Device Letters 39 (8), 1215-1218, 2018 | 3 | 2018 |
| A Substrate-Agnostic, Submicrometer PSAS-to-PSAS Self-Alignment Technology for Heterogeneous Integration JL Gonzalez, SK Rajan, JR Brescia, MS Bakir IEEE Transactions on Components, Packaging and Manufacturing Technology 11 …, 2021 | 2 | 2021 |
| Fabrication of and cell growth on ‘silicon membranes’ with high density TSVs for bio-sensing applications M Zia, C Zhang, P Thadesar, T Hookway, T Chi, J Gonzalez, T McDevitt, ... 2015 IEEE Biomedical Circuits and Systems Conference (BioCAS), 1-4, 2015 | 2 | 2015 |
| Heterogeneous Integration of Chiplets Using Socketed Platforms, Off-Chip Flexible Interconnects, and Self-Alignment Technologies JL Gonzalez Georgia Institute of Technology, 2021 | 1 | 2021 |
| A Die-Level, Replaceable Integrated Chiplet (PINCH) Assembly Using a Socketed Platform, Compressible MicroInterconnects, and Self-Alignment JL Gonzalez, JR Brescia, T Zheng, SK Rajan, MS Bakir IEEE Transactions on Components, Packaging and Manufacturing Technology 11 …, 2021 | | 2021 |
| Heterogeneous Multi-Die High-Density Interconnect Stitching PK Jo, X Zhang, JL Gonzalez, MS Bakir Georgia Institute of Technology Atlanta United States, 2018 | | 2018 |
| Power Conversion Gain as a Design Metric for RFID Systems JT Block, L Blanca-Pimentel, JL Gonzalez, MJ Almada, CR Valenta, ... IEEE ANTENNAS AND PROPAGATION SOCIETY INTERNATIONAL SYMPOSIUM 1 (1), 523-524, 2012 | | 2012 |
| Advanced Packaging Technologies M Langenmair, M Hofert, M Eickenscheidt, T Stieglitz, S Wang, Z Zhong, ... | | |
Paul Kim JoGeorgia Institute of TechnolofyVerified email at gatech.edu
