Volume of fluid simulation of boiling two-phase flow in a vapor-venting microchannel C Fang, M David, A Rogacs, K Goodson Frontiers in Heat and Mass Transfer (FHMT) 1 (1), 2010 | 187 | 2010 |
Server liquid cooling with chiller-less data center design to enable significant energy savings M Iyengar, M David, P Parida, V Kamath, B Kochuparambil, D Graybill, ... 2012 28th annual IEEE semiconductor thermal measurement and management …, 2012 | 142 | 2012 |
Hydraulic and thermal characteristics of a vapor venting two-phase microchannel heat exchanger MP David, J Miler, JE Steinbrenner, Y Yang, M Touzelbaev, KE Goodson International Journal of Heat and Mass Transfer 54 (25-26), 5504-5516, 2011 | 119 | 2011 |
Experimental characterization of an energy efficient chiller-less data center test facility with warm water cooled servers MP David, M Iyengar, P Parida, R Simons, M Schultz, M Gaynes, ... 2012 28th Annual IEEE Semiconductor Thermal Measurement and Management …, 2012 | 74 | 2012 |
Pump-enhanced, immersion-cooling of electronic component (s) LA Campbell, RC Chu, MP David, MJ Ellsworth Jr, MK Iyengar, ... US Patent 9,357,675, 2016 | 72 | 2016 |
Data center cooling with an air-side economizer and liquid-cooled electronics rack (s) LA Campbell, RC Chu, MP David, MJ Ellsworth Jr, MK Iyengar, ... US Patent 8,959,941, 2015 | 65 | 2015 |
Experimental and numerical dynamic investigation of an energy efficient liquid cooled chiller-less data center test facility T Gao, M David, J Geer, R Schmidt, B Sammakia Energy and buildings 91, 83-96, 2015 | 64 | 2015 |
Multi-fluid, two-phase immersion-cooling of electronic component (s) LA Campbell, RC Chu, MP David, MJ Ellsworth Jr, MK Iyengar, ... US Patent 8,619,425, 2013 | 64 | 2013 |
Valve controlled, node-level vapor condensation for two-phase heat sink (s) LA Campbell, RC Chu, MP David, MJ Ellsworth Jr, MK Iyengar, ... US Patent 9,069,532, 2015 | 62 | 2015 |
Wicking vapor-condenser facilitating immersion-cooling of electronic component (s) LA Campbell, RC Chu, MP David, MJ Ellsworth Jr, MK Iyengar, ... US Patent 8,953,317, 2015 | 62 | 2015 |
Dynamically limiting energy consumed by cooling apparatus TJ Chainer, MP David, MK Iyengar, PR Parida, RR Schmidt, MD Schultz US Patent 9,043,035, 2015 | 61 | 2015 |
Influence of film thickness and cross-sectional geometry on hydrophilic microchannel condensation C Fang, M David, F Wang, KE Goodson International journal of multiphase flow 36 (8), 608-619, 2010 | 59 | 2010 |
Multi-rack assembly method with shared cooling unit LA Campbell, RC Chu, MP David, MJ Ellsworth Jr, MK Iyengar, ... US Patent 8,797,740, 2014 | 58 | 2014 |
Two-phase, water-based immersion-cooling apparatus with passive deionization LA Campbell, RC Chu, MP David, MJ Ellsworth Jr, MK Iyengar, ... US Patent 8,867,209, 2014 | 57 | 2014 |
Thermal transfer structures coupling electronics card (s) to coolant-cooled structure (s) MP David, DP Graybill, MK Iyengar, V Kamath, BJ Kochuparambil, ... US Patent 8,913,384, 2014 | 56 | 2014 |
Multi-rack assembly with shared cooling unit LA Campbell, RC Chu, MP David, MJ Ellsworth Jr, MK Iyengar, ... US Patent 8,817,474, 2014 | 54 | 2014 |
Dynamically limiting energy consumed by cooling apparatus TJ Chainer, MP David, MK Iyengar, PR Parida, RR Schmidt, MD Schultz US Patent 9,052,722, 2015 | 53 | 2015 |
Sectioned manifolds facilitating pumped immersion-cooling of electronic components LA Campbell, RC Chu, MP David, MJ Ellsworth Jr, MK Iyengar, ... US Patent 8,964,391, 2015 | 52 | 2015 |
Pump-enhanced, sub-cooling of immersion-cooling fluid LA Campbell, RC Chu, MP David, MJ Ellsworth Jr, MK Iyengar, ... US Patent 9,261,308, 2016 | 47 | 2016 |
Separate control of coolant flow through coolant circuits LA Campbell, RC Chu, MP David, MJ Ellsworth Jr, MK Iyengar, ... US Patent 9,148,983, 2015 | 47 | 2015 |