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Umamaheswara Rao Tida
Umamaheswara Rao Tida
Assistant Professor, North Dakota State University
Verified email at ndsu.edu - Homepage
Title
Cited by
Cited by
Year
On the efficacy of through-silicon-via inductors
UR Tida, R Yang, C Zhuo, Y Shi
IEEE Transactions on Very Large Scale Integration (VLSI) Systems 23 (7 …, 2014
722014
Novel through-silicon-via inductor-based on-chip DC-DC converter designs in 3D ICs
UR Tida, C Zhuo, Y Shi
ACM Journal on Emerging Technologies in Computing Systems (JETC) 11 (2), 1-14, 2014
502014
Through-silicon-via inductor: Is it real or just a fantasy?
UR Tida, C Zhuo, Y Shi
2014 19th Asia and South Pacific Design Automation Conference (ASP-DAC), 837-842, 2014
382014
Dynamic frequency scaling aware opportunistic through-silicon-via inductor utilization in resonant clocking
UR Tida, C Zhuo, L Liu, Y Shi
IEEE Transactions on Computer-Aided Design of Integrated Circuits and …, 2018
222018
Single-inductor–multiple-tier regulation: TSV-inductor-based on-chip buck converters for 3-D IC power delivery
UR Tida, C Zhuo, Y Shi
IEEE Transactions on Very Large Scale Integration (VLSI) Systems 27 (10 …, 2019
212019
Opportunistic through-silicon-via inductor utilization in LC resonant clocks: concept and algorithms
UR Tida, V Mittapalli, C Zhuo, Y Shi
2014 IEEE/ACM International Conference on Computer-Aided Design (ICCAD), 750-757, 2014
182014
"Green" on-chip inductors in three-dimensional integrated circuits
UR Tida
Missouri University of Science and Technology, 2014
112014
" Green" on-chip inductors in three-dimensional integrated circuits
UR Tida, V Mittapalli, C Zhuo, Y Shi
2014 IEEE Computer Society Annual Symposium on VLSI, 571-576, 2014
112014
Recent advances in dielectrophoresis toward biomarker detection: A summary of studies published between 2014 and 2021
L Velmanickam, V Jayasooriya, MS Vemuri, UR Tida, D Nawarathna
Electrophoresis 43 (1-2), 212-231, 2022
92022
Modeling and optimization of magnetic core tsv-inductor for on-chip dc-dc converter
B Chen, U Tida, C Zhuo, Y Shi
2018 IEEE/ACM International Conference on Computer-Aided Design (ICCAD), 1-8, 2018
92018
Efficient metal inter-layer via utilization strategies for three-dimensional integrated circuits
UR Tida, MS Vemuri
2020 IEEE 33rd International System-on-Chip Conference (SOCC), 195-200, 2020
62020
Design and optimization of magnetic-core solenoid inductor for multi-phase buck converter
MS Vemuri, UR Tida
2020 IEEE 63rd International Midwest Symposium on Circuits and Systems …, 2020
62020
Dual-Purpose Metal Inter-layer Via Utilization in Monolithic Three-Dimensional (M3D) Integration
MS Vemuri, UR Tida
2020 IEEE 63rd International Midwest Symposium on Circuits and Systems …, 2020
62020
PWM-controlled DC-DC converter designs in 3D ICs using through-silicon-via inductors
PN Kankonkar, UR Tida, C Zhou, Y Shi
2016 China Semiconductor Technology International Conference (CSTIC), 1-3, 2016
62016
Metal Inter-layer Via Keep-out-zone in M3D IC: A Critical Process-aware Design Consideration
MS Vemuri, UR Tida
2023 24th International Symposium on Quality Electronic Design (ISQED), 1-8, 2023
42023
Magnetic core TSV-inductor design and optimization for on-chip DC-DC converter
C Wen, X Dong, B Chen, UR Tida, Y Shi, C Zhuo
ACM Transactions on Design Automation of Electronic Systems (TODAES) 27 (5 …, 2022
42022
FDSOI Process Based MIV-transistor Utilization for Standard Cell Designs in Monolithic 3D Integration
MS Vemuri, UR Tida
2023 IEEE 36th International System-on-Chip Conference (SOCC), 1-6, 2023
22023
Efficient and Scalable MIV-transistor with Extended Gate in Monolithic 3D Integration
MS Vemuri, UR Tida
2023 IEEE 66th International Midwest Symposium on Circuits and Systems …, 2023
22023
An Improved Quadrature Voltage-Controlled Oscillator with Through-Silicon-Via Inductor in Three-dimensional Integrated Circuits
D Li, MS Vemuri, UR Tida
arXiv preprint arXiv:2001.10678, 2020
22020
Design, Analysis and Optimization of Magnetic-core Solenoid Inductor for On-chip Multi-phase Buck Converter
M Elma, MS Vemuri, UR Tida
IEEE Access, 2023
12023
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