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- Fan RenUniversity of Florida, Bell Lab, AT&TVerified email at che.ufl.edu
- Changzhi LiTexas Tech UniversityVerified email at ttu.edu
- Stephen PeartonProfessor of Materials Science and Engineering, University of FloridaVerified email at mse.ufl.edu
- Zhen Ning LowQualcommVerified email at qualcomm.com
- Tatsuo ItohProfessor of Electrical Engineering, UCLAVerified email at ee.ucla.edu
- Li-Chia Tien (田禮嘉)Professor, National Dong Hwa UniversityVerified email at mail.ndhu.edu.tw
- Brent P. GilaUniversity of FloridaVerified email at ufl.edu
- Travis J. AndersonUniversity of FloridaVerified email at che.ufl.edu
- Yu-Te LiaoNational Yang Ming Chiao Tung UniversityVerified email at g2.nctu.edu.tw
- Byung-Hwan ChuIBM, Samsung, U or FloridaVerified email at ufl.edu
- Tzyy-Sheng HorngProf. of Electrical Engineering, National Sun Yat-Sen University, TaiwanVerified email at ee.nsysu.edu.tw
- Tien-Yu HuangQualcommVerified email at qti.qualcomm.com
- Yves BaeyensNokia Bell-LabsVerified email at columbia.edu
- Lars VossLawrence Livermore National LaboratoryVerified email at llnl.gov
- Jiancheng Yang. PhDKeysight TechnologiesVerified email at keysight.com
- Yu-Lin WangNational Tsing Hua University, Institute of Nanoengineering and MicrosystemsVerified email at mx.nthu.edu.tw
- Jianxuan TuVerified email at ufl.edu
- Ryan TsengShield AIVerified email at shield.ai
- Fu-Kang Wang國立中山大學電機工程學系Verified email at student.nsysu.edu.tw
- Wayne JohnsonSoundside Partners LLCVerified email at soundsidepartners.com