| Defect detection strategies and process partitioning for SE EUV patterning L Meli, K Petrillo, A De Silva, J Arnold, N Felix, C Robinson, B Briggs, ... Extreme Ultraviolet (EUV) Lithography IX 10583, 87-103, 2018 | 17 | 2018 |
| Printability and actinic AIMS review of programmed mask blank defects E Verduijn, P Mangat, O Wood, J Rankin, Y Chen, F Goodwin, R Capelli, ... Extreme Ultraviolet (EUV) Lithography VIII 10143, 112-124, 2017 | 12 | 2017 |
| Defect detection strategies and process partitioning for single-expose EUV patterning L Meli, K Petrillo, A De Silva, J Arnold, N Felix, C Robinson, B Briggs, ... Journal of Micro/Nanolithography, MEMS, and MOEMS 18 (1), 011006-011006, 2019 | 11 | 2019 |
| Fundamental characterization of stochastic variation for improved single-expose EUV patterning at aggressive pitch J Church, L Meli, J Guo, M Burkhardt, C Mack, A DeSilva, K Petrillo, ... Extreme Ultraviolet (EUV) Lithography XI 11323, 165-173, 2020 | 6 | 2020 |
| Development of TiO2 containing hardmasks through PEALD deposition A De Silva, I Seshadri, K Chung, A Arceo, L Meli, B Mendoza, Y Sulehria, ... Advances in Patterning Materials and Processes XXXIV 10146, 240-250, 2017 | 6 | 2017 |
| Fundamental characterization of stochastic variation for improved single-expose extreme ultraviolet patterning at aggressive pitch J Church, L Meli, J Guo, M Burkhardt, C Mack, A De Silva, K Petrillo, ... Journal of Micro/Nanolithography, MEMS, and MOEMS 19 (3), 034001-034001, 2020 | 4 | 2020 |
| Development of TiO2 containing hardmasks through plasma-enhanced atomic layer deposition A De Silva, I Seshadri, K Chung, A Arceo, L Meli, B Mendoza, Y Sulehria, ... Journal of Micro/Nanolithography, MEMS, and MOEMS 16 (2), 023504-023504, 2017 | 2 | 2017 |
| Multilayer dielectric stack for damascene top-via integration S Mukesh, DS Grant, FL Lie, SK Matham, H Shobha, G Karve US Patent App. 17/445,698, 2023 | 1 | 2023 |
| Transmission Electron Microscopy Sample Preparation By Design Based Recipe Writing in a DBFIB Part 2 J Demarest, B Austin, J Arjavac, M Breton, M Bergendahl, M Biedrzycki, ... ISTFA 2019, 470-471, 2019 | 1 | 2019 |
| Transmission Electron Microscopy Sample Preparation By Design-Based Recipe Writing in a DBFIB J Demarest, B Austin, J Arjavac, M Breton, M Bergendahl, M Biedrzycki, ... ISTFA 2018, 238-240, 2018 | 1 | 2018 |
| Utilization of ExtractAI™ inspection and review methodology to accelerate process development in advanced technology nodes TA Esposito, N Mowell, S Matham, S Emans, M Islam, R Sheraw, ... 2023 34th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC …, 2023 | | 2023 |
| Advanced wafer security method including pattern and wafer verifications E Leobandung, C Boye, FL Lie, SK Matham, B Austin US Patent 11,031,346, 2021 | | 2021 |
| Missing Via Defect Capture Enhancement Using a Novel, High-Precision Array Segmentation Inspection Technique G Jensen, V Anantha, A Greer, R Babulnath, S Kurada, B Austin, ... 2021 32nd Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC …, 2021 | | 2021 |
| High-throughput, nondestructive assessment of defects in patterned epitaxial films on silicon by machine learning-enabled broadband plasma optical measurements S Matham, C Durfee, B Mendoza, DK Sadana, SW Bedell, J Gaudiello, ... 2019 30th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC …, 2019 | | 2019 |
