| Kannada alphabets recognition using decision tree and random forest models KK Dutta, A Victor, AG Nathu, MA Habib, D Parashar 2020 3rd International Conference on Intelligent Sustainable Systems (ICISS …, 2020 | 26 | 2020 |
| Accurate battery modeling based on pulse charging using MATLAB/Simulink S Surya, J Channegowda, SD Datar, AS Jha, A Victor 2020 IEEE International Conference on Power Electronics, Drives and Energy …, 2020 | 14 | 2020 |
| Design, simulation and comparative analysis of different types of solar charge controllers for optimized efficiency A Victor, DK Mahato, A Pundir, GJ Saxena 2019 Women Institute of Technology Conference on Electrical and Computer …, 2019 | 4 | 2019 |
| Reconstituted-sio2 tier with integrated copper heat spreader A Victor, M Manley, S Oh, MS Bakir 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 1767-1772, 2023 | 3 | 2023 |
| Heterogeneous Integration Technologies for Artificial Intelligence Applications M Manley, A Victor, H Park, A Kaul, M Kathaperumal, MS Bakir IEEE Journal on Exploratory Solid-State Computational Devices and Circuits, 2024 | 1 | 2024 |
| Inverse Hybrid Bonding with Metal Oxide Framework as Infill for Heterogeneous Integration R Sahay, D Pal, A Victor, CH Kuo, M Manley, H Simka, A Kummel, M Bakir 2024 IEEE 74th Electronic Components and Technology Conference (ECTC), 1837-1840, 2024 | 1 | 2024 |
| Exploiting Chiplet Integration Technology for Fast High-Capacity DRAM Modules Z Xia, C Song, R Krishna, A Victor, S Penta, MS Bakir, E Rosenbaum, ... IEEE Transactions on Very Large Scale Integration (VLSI) Systems, 2025 | | 2025 |
| Tier Transfer of Ultra-thin Reconstituted-SiO2 Chiplet Tiers A Victor, MS Bakir IEEE Transactions on Components, Packaging and Manufacturing Technology, 2025 | | 2025 |
| Yield-Aware Interposer Design for UCIe Interconnects R Krishna, A Victor, S Penta, X Chen, MS Bakir, NS Kim, E Rosenbaum 2024 IEEE 33rd Conference on Electrical Performance of Electronic Packaging …, 2024 | | 2024 |
